Our Company
Our Story
At TeraSignal, we’re more than just a semiconductor company – we’re pioneers in the field of AI connectivity. Founded with a vision to revolutionize the way organizations harness the power of artificial intelligence, TeraSignal has quickly risen to prominence as a leader in semiconductor design. Our journey began with a simple yet ambitious goal: to develop cutting-edge transceivers that would set new standards for efficiency, performance, and innovation in AI applications.
Intelligent Connectivity for AI Infrastructure
TeraSignal is advancing high-speed connectivity for AI infrastructure with intelligent linear interconnect technology spanning copper and optics. The company combines advanced CMOS design, Analog Wave Processing (AWP) and TSLink adaptive link training to improve signal integrity, reduce power and latency, and increase link reliability at 200G/lane and beyond.
From ACC and LPO to NPO and CPO, TeraSignal provides a common intelligent connectivity architecture designed to scale AI interconnects to 1.6T, 3.2T and beyond.
Built for 200G/Lane and Beyond
As AI infrastructure scales, high-speed links face greater channel loss, reflections, component variation and system-level complexity.
TeraSignal brings intelligence directly into the interconnect. TSLink measures and adapts operation to real-world channel conditions, while AWP performs advanced signal processing directly on broadband electrical waveforms. Together, they increase link margin, improve robustness and extend the practical reach of DSP-free linear connectivity while preserving its fundamental advantages in power and latency.
Mission and Values
Our mission at TeraSignal is clear: to empower AI connectivity through revolutionary semiconductor solutions. We believe that technology has the power to transform industries, drive innovation, and create a better future for all. Guided by this vision, we are committed to pushing the boundaries of what’s possible, relentlessly pursuing excellence in everything we do.
Expertise and Innovation
At the heart of TeraSignal’s success lies our unparalleled expertise and commitment to innovation. Our team of skilled engineers and researchers are dedicated to pushing the limits of semiconductor design, constantly exploring new technologies and methodologies to stay ahead of the curve. Through our relentless pursuit of excellence, we continue to pioneer breakthroughs in AI connectivity, shaping the future of the industry.
Fabless Semiconductor Leadership
As a fabless semiconductor company, TeraSignal operates on the principle of focus and specialization. By dedicating ourselves exclusively to semiconductor design, we are able to channel all our resources and expertise into creating the most advanced solutions possible. This streamlined approach allows us to maintain agility, flexibility, and efficiency, ensuring that we deliver products that exceed expectations every time.
Our Promise
At TeraSignal, we promise to continue pushing the boundaries of innovation, delivering products that empower organizations to achieve their goals and drive meaningful change. With a relentless commitment to excellence, integrity, and customer satisfaction, we are dedicated to being a trusted partner in the journey towards a smarter, more connected world.
Founder and CEO
Dr. Armond Hairapetian is the founder and CEO of TeraSignal, where he is leading the development of intelligent interconnect technology for AI infrastructure. Combining deep expertise in high-speed communications, analog and mixed-signal design, and semiconductor product development, Dr. Hairapetian has spent his career developing technologies that push the limits of high-speed connectivity.
Dr. Hairapetian’s first start-up, NewPort Communications, helped transform the high-speed networking interface market by delivering the industry’s first 10G transceiver and SerDes solutions in CMOS. Armond served as vice president of product development, product roadmap and market strategy as the company grew from the ground up through its acquisition by Broadcom in October 2000 for $1.2 billion.
At Broadcom, Dr. Hairapetian helped build and lead the company’s Optical Line of Business from a non-player in optical communications to a leading supplier of 10G CMOS optical and high-speed copper transceiver products. The organization grew to approximately $100 million in annual revenue and helped establish Broadcom as a leading supplier of switching and ASIC solutions.
After leaving Broadcom in 2004 to pursue a career in venture capital, Dr. Hairapetian returned following Broadcom’s acquisition by Avago in 2016 to help grow the newly formed Physical Layer Product business. He initiated and led programs that resulted in the development of the world’s first 100G/lane PAM4 DSP with an integrated TIA and the world’s first RF sampling radio for massive MIMO 5G/FR1 base stations.
Dr. Armond Hairapetian
Founder and CEO of TeraSignal
Dr. Hairapetian left Broadcom in 2022 to found TeraSignal.
He holds B.S., M.S. and Ph.D. degrees in electrical engineering from UCLA and is an inventor on more than 30 patents. Today, his work at TeraSignal is focused on bringing intelligence, adaptability and advanced wave processing to 200G/lane linear interconnects, enabling lower-power, lower-latency connectivity for the rapidly scaling AI infrastructure market.
What is Intelligent Linear Connectivity?
Intelligent linear connectivity combines the low power and low latency of DSP-free interconnects with real-time link awareness and advanced signal processing.
TeraSignal’s TSLink technology uses CMIS Link Training to coordinate link parameters between interoperating devices and adapt operation to actual channel conditions. AWP complements that intelligence by performing weighting, delay, accumulation and other signal-processing functions directly on broadband electrical waveforms rather than digitized samples.
Together, AWP + TSLink create an intelligent, adaptive connectivity architecture designed to improve link margin, reliability and reach across both copper and optical AI interconnects — including ACC, LPO, NPO and CPO.