Learn More About TeraSignal
Our Story
At TeraSignal, we’re more than just a semiconductor company – we’re pioneers in the field of AI connectivity. Founded with a vision to revolutionize the way organizations harness the power of artificial intelligence, TeraSignal has quickly risen to prominence as a leader in semiconductor design. Our journey began with a simple yet ambitious goal: to develop cutting-edge transceivers that would set new standards for efficiency, performance, and innovation in AI applications.
Intelligent Interconnects
TeraSignal is pioneering the transformation of AI and compute interconnects with its Intelligent Re-Driver (IRD) technology. The company’s solutions, designed in CMOS technology with digital eye monitor diagnostics and link training, aim to overcome the limitations of current pluggable optical modules by reducing power consumption, latency, and enhancing signal integrity for 100G to 200G per lane connections. TeraSignal’s innovative IRD technology addresses the critical challenges of high-speed data transmission, offering lower-power, lower latency and reliable solutions for the deployment of AI in data centers.
Unlocking the Future
Representing a leap forward in optical connectivity, TeraSignal’s IRD technology combines electronics and photonics to enable the next generation of intelligent LPO modules and accelerate the exploding AI re-timer market, which is projected to reach $1.23 billion by 2024.
Mission and Values
Our mission at TeraSignal is clear: to empower AI connectivity through revolutionary semiconductor solutions. We believe that technology has the power to transform industries, drive innovation, and create a better future for all. Guided by this vision, we are committed to pushing the boundaries of what’s possible, relentlessly pursuing excellence in everything we do.
Expertise and Innovation
At the heart of TeraSignal’s success lies our unparalleled expertise and commitment to innovation. Our team of skilled engineers and researchers are dedicated to pushing the limits of semiconductor design, constantly exploring new technologies and methodologies to stay ahead of the curve. Through our relentless pursuit of excellence, we continue to pioneer breakthroughs in AI connectivity, shaping the future of the industry.
Fabless Semiconductor Leadership
As a fabless semiconductor company, TeraSignal operates on the principle of focus and specialization. By dedicating ourselves exclusively to semiconductor design, we are able to channel all our resources and expertise into creating the most advanced solutions possible. This streamlined approach allows us to maintain agility, flexibility, and efficiency, ensuring that we deliver products that exceed expectations every time.
Our Promise
At TeraSignal, we promise to continue pushing the boundaries of innovation, delivering products that empower organizations to achieve their goals and drive meaningful change. With a relentless commitment to excellence, integrity, and customer satisfaction, we are dedicated to being a trusted partner in the journey towards a smarter, more connected world.
Founder and CEO
Dr. Armond Hairapetian is the founder and CEO of TeraSignal, a leading provider of intelligent silicon solutions for AI bandwidth. TeraSignal’s fusion of electronics and photonics is transforming AI and compute interconnects with Intelligent Re-Driver (IRD) technology. Offering power-efficient, low-latency solutions that enhance signal integrity for 100G and 200G connections, TeraSignal addresses the evolving needs for scaling AI bandwidth in data centers.
Dr. Hairapetian’s first start-up NewPort Communications transformed the high-speed networking interface by delivering the industry’s first 10G transceiver and SerDes solutions in CMOS. Armond was deeply involved with design and product development, product roadmap and market strategy, and as NewPort’s CEO, he also grew the company from the ground up to its acquisition by Broadcom in October 2000 for $1.2 billion.
As the general manager of Broadcom’s newly formed Optical Line of Business, Armond helped elevate Broadcom from a non-player in the optical communication market to the leading supplier of 10G CMOS optical/high-speed copper transceiver products. The integration of the 10G interface in Broadcom’s switching and ASIC products enabled the company to become the leading supplier of switching and ASIC solutions in the industry – a position that Broadcom continues to maintain to date.
Dr. Armond Hairapetian
Founder and CEO of TeraSignal
Dr. Hairapetian left Broadcom in 2004 to pursue a career as a venture capitalist but returned after Broadcom was acquired by Avago in 2016 to help grow the newly formed Physical Layer Product (PLP) business unit. Dr. Hairapetian initiated and led two programs that resulted in the development of the world’s first 100G/lane PAM4 DSP with an integrated TIA, as well as world’s first RF sampling radio for massive MIMO 5G/FR1 base stations. Dr. Hairapetian left Broadcom in 2022 to found TeraSignal.
Holding B.S., M.S., and Ph.D. degrees in electrical engineering from UCLA, along with more than 30 patents, Dr. Hairapetian has combined his technical, business and entrepreneurial drive to challenge the status quo and build industry-leading networking products. Focused on the future of AI deployment in data centers, TeraSignal’s innovative IRD technology addresses the critical challenges of high-speed data transmission, offering low-power, low-latency and reliable effective solutions for the emerging AI-centric infrastructure.
What is an Intelligent LPO?
Intelligent linear pluggable optical (LPO) modules, as pioneered by TeraSignal, represent a significant advancement in the field of AI and compute interconnects. These modules, powered by the intelligent TS8401/02 product series, are equipped with TeraSignal’s CMOS-based IRD technology, revolutionizing the way data centers operate. Unlike traditional LPO modules, intelligent LPOs are designed with embedded microcontrollers that automate critical adjustments, providing automatic adaptation, digital link monitoring, and training capabilities. This not only simplifies the integration, interoperability, and deployment processes but also enhances the performance and reliability of data center connectivity. The incorporation of digital eye monitor diagnostics and link accountability features transforms these modules into self-optimizing systems, capable of addressing the complex requirements of AI and compute-intensive applications inside data centers with unprecedented efficiency and lower latency.