TSLink: Protocol-Agnostic Intelligent Interconnect for Plug-and-Play Linear Optics
Transforming High-Speed Data Connectivity
TeraSignal stands at the forefront of transforming high-speed data communication with its intelligent CMOS-based re-driver solutions tailored for intelligent LPO modules. This innovative approach seamlessly integrates low latency and power efficiency, enhancing link capabilities and diagnostics while ensuring rapid deployment. TeraSignal’s IRD technology deliver unmatched performance across both fiber and copper networks. The introduction of CMOS re-driver devices, featuring intelligence embedded within the re-driver, marks a significant leap forward for the optical interconnect industry. These devices emulate the functionality of DSPs while offering significantly lower power consumption and minimal latency.
Plug-and-Play Linear Optics
TSLink by TeraSignal is the world’s first intelligent chip-to-module (C2M) interconnect designed to transform data transmission in AI-driven data centers. It eliminates the need for DSPs, reducing power consumption by over 50% and minimizing latency, ensuring faster, more efficient data flow. With automatic link training, real-time diagnostics, and seamless integration into 800G LPO modules, TSLink delivers superior signal integrity and reliability. Its protocol-agnostic architecture supports various high-speed protocols, making it the perfect solution for next-generation AI and high-performance computing environments. TSLink is the future of scalable, energy-efficient connectivity.
Link Diagnostics Capabilities
TSLink leverages the DSP-based SerDes functionality already present in AI ASICs and GPUs, providing a streamlined connection that optimizes performance across various protocols and modulation schemes. This architectural innovation, enabled by TeraSignal’s TS8401/02 Intelligent Re-Drivers, positions the company at the forefront of interconnect technology by offering a highly adaptable and energy-efficient solution for next-generation AI infrastructure.
TSLink Training Explained
Link training is a critical feature of TSLink that ensures the highest quality of signal transmission. During link training, the transmitter in the DSP-based SerDes within the ASIC or GPU is trained to understand and adapt to the specific characteristics of the transmission channel. This process involves characterizing channel impairments, such as Inter-Symbol Interference (ISI) and eliminating them by pre-processing the signal. This optimization allows the signal to pass through the channel with minimum ISI and reflection, reducing errors and eliminating the need for additional DSP processing in the receiver. This results in a highly reliable and power efficient data transmission through the link with minimum bit-error-rate.
Technology Benefits
Join us as we revolutionize high-speed interconnects with TSLink, the world’s first intelligent chip-to-module (C2M) interconnect for AI-centric infrastructure. Explore how TSLink can transform your network’s power efficiency, performance, and reliability, setting new standards for AI-driven connectivity.
50% Power Reduction
TSLink slashes power consumption by over 50%, leveraging advanced CMOS technology. By eliminating the need for DSPs, TSLink not only reduces costs but also supports sustainability, delivering high-performance data transmission with significantly lower energy demands.
Latency Minimization
TSLink’s architecture removes latency-inducing DSPs, streamlining the signal path for real-time performance. This reduction in transmission delay makes TSLink ideal for AI and high-performance computing environments that demand fast, reliable data flow without latency bottlenecks.
Advanced Link Diagnostics
With integrated digital eye monitoring, TSLink offers unparalleled link diagnostics. This feature provides real-time insights into signal performance, enabling adaptive monitoring and optimization, ensuring high signal integrity and network reliability.
Seamless Integration
TSLink simplifies deployment by supporting automatic link training and real-time performance monitoring with host SerDes. This plug-and-play capability accelerates integration and reduces maintenance, allowing high-speed optical links to operate at peak efficiency.
Faster Market Readiness
Designed for quick implementation, TSLink accelerates project timelines, allowing faster time-to-market. Its adaptability ensures that businesses can stay competitive, leveraging the latest advancements in AI and high-performance computing infrastructure.
Versatile Connectivity
TSLink offers superior performance over both fiber and copper interconnects, allowing seamless integration into a variety of infrastructure types. This flexibility ensures that no matter the network composition, TSLink delivers unmatched efficiency and scalability.
Why Choose Our Semiconductors
Industry-Leading Performance
TeraSignal's products are engineered to deliver industry-leading performance, ensuring that organizations stay ahead of the competition.
Reliability and Durability
Built to withstand the demands of even the most challenging environments, our products are designed for reliability and durability.
Scalability and Flexibility
With scalability and flexibility in mind, TeraSignal's products can easily adapt to evolving business needs and requirements.
Ease of Integration
Seamlessly integrate TeraSignal's products into existing infrastructure with ease, minimizing downtime and maximizing efficiency.
TSLink Features
- Automatic Link Training: By leveraging the Common Management Interface Specification (CMIS), TSLink automatically characterizes the host to module channel and provides the optimum settings for the DSP-based transmitter in the host.
- Link Diagnostics and Monitoring: TSLink includes features like digital eye monitoring and bit error rate (BER) reporting, allowing users to easily monitor channel conditions and ensure optimal performance in the link.
- Reduced Power Consumption: By using existing microcontroller resources and eliminating the need for additional DSPs, TSLink reduces power consumption by at least 50%, making it a more sustainable solution for high-density AI deployments.
- Lower Bit Error Rate: TSLink eliminates the quantization noise introduced by analog-to-digital converters (ADCs) in DSP-based re-timers, significantly improving the BER in the link.
- Reduced Latency: TSLink removes the high latency caused by DSP processing, enabling shorter transmission time, which is critical for high-performance, compute-intensive AI applications.
- Improved Signal Integrity: The advanced link training process shapes the transmit signal based on the characteristics of each individual channel, ensuring maximum signal to noise ratio at the receiver.
- Small Form Factor: Eliminating the need for DSPs results in at least a 50% reduction in silicon die size, contributing to lower production costs and higher density linear optics.
What is Linear Optics?
Linear Optics, a term increasingly used to describe optical modules that operate without DSP re-timers, represents a paradigm shift in data center technology. By removing the DSP, these modules significantly reduce power consumption while maintaining high signal integrity, making them ideal for the next generation of AI infrastructure. This innovation is crucial for meeting the demands of high-speed, low-latency data transmission in AI-centric data centers.