AWP + TSLink: Intelligent Linear Connectivity
TeraSignal combines Analog Wave Processing (AWP) with TSLink intelligent link training to bring advanced signal processing, diagnostics and adaptive optimization directly into high-speed optical and copper interconnects. Together, they enable lower-power, lower-latency connectivity for 200G/lane, 1.6T and 3.2T AI infrastructure.
Wave-Domain Processing with Analog Wave Processing (AWP)
TeraSignal’s Analog Wave Processor performs mathematical operations directly on broadband electrical waveforms. Unlike conventional analog equalizers or DSP-based architectures that operate on digitized samples, AWP performs weighting, delay and accumulation directly in the analog domain. This enables advanced signal processing while preserving the low-power and low-latency advantages of linear interconnects.
AWP supports ultra-high-bandwidth processing, linear amplitude and phase response, equalization beyond the Nyquist frequency, wave-domain FFE and reflection mitigation for demanding 200G/lane and future high-speed links.
Intelligent Link Training with TSLink
TSLink brings intelligence directly into the connectivity layer through CMIS-based link training, real-time monitoring and adaptive optimization. Rather than relying on fixed link settings, TSLink measures actual channel conditions and automatically helps optimize link performance.
This enables more reliable DSP-free linear interconnects across optical and copper architectures while improving link margin, robustness and deployment confidence.
Intelligent Closed-Loop Connectivity
AWP and TSLink work together as a closed-loop connectivity architecture.
TSLink identifies link and channel conditions. Analog Wave Processing (AWP) provides the wave-processing capabilities needed to compensate for impairments.
Together, they bring intelligence and advanced signal processing directly into the physical connectivity layer—helping extend the practical reach of DSP-free linear interconnects while improving link margin and reliability.
How AWP + TSLink Work Together
TSLink provides the intelligence needed to understand the link, including channel conditions, link training and monitoring. AWP provides the wave-domain processing needed to optimize signal performance. This combination enables intelligent, adaptive linear connectivity without introducing the power and latency associated with conventional DSP-based architectures.
Technology Benefits
Join us as we revolutionize high-speed interconnects with TSLink, the world’s first intelligent chip-to-module (C2M) interconnect for AI-centric infrastructure. Explore how TSLink can transform your network’s power efficiency, performance, and reliability, setting new standards for AI-driven connectivity.
Lower Power
Preserves the fundamental power advantage of DSP-free linear connectivity by performing high-speed processing directly in the analog domain.
Lower Latency
Avoids the high-speed conversion and digital processing associated with conventional DSP architectures.
Ultra-High Bandwidth
AWP enables broadband wave processing for 200G/lane and future high-speed interconnects.
Linear Amplitude + Phase
Maintains both amplitude and phase integrity across wide bandwidths to reduce distortion in demanding high-speed links.
Adaptive Link Intelligence
TSLink provides CMIS-based link training, diagnostics and real-time monitoring to optimize performance for actual channel conditions.
Optical + Copper Connectivity
A common intelligent architecture spanning ACC, LPO, NPO, CPO and other next-generation optical and copper interconnects.
Why Choose Our Semiconductors
Industry-Leading Performance
TeraSignal's products are engineered to deliver industry-leading performance, ensuring that organizations stay ahead of the competition.
Reliability and Durability
Built to withstand the demands of even the most challenging environments, our products are designed for reliability and durability.
Scalability and Flexibility
With scalability and flexibility in mind, TeraSignal's products can easily adapt to evolving business needs and requirements.
Ease of Integration
Seamlessly integrate TeraSignal's products into existing infrastructure with ease, minimizing downtime and maximizing efficiency.
Core Technology
- AWP Analog Wave Processing: Performs weighting, delay and accumulation directly on broadband waveforms for advanced analog signal processing.
- TSLink Intelligent Link Training: Uses CMIS-based link training to measure, monitor and optimize link operation.
- Advanced CMOS Design: Enables highly integrated, scalable connectivity with lower power and improved economics compared with legacy approaches.
- DSP-Free Linear Connectivity: Preserves the low-power and low-latency benefits of linear links while adding advanced processing and intelligence.
- Intelligent EIC Architecture: Moves diagnostics, optimization and adaptability directly into the connectivity layer rather than treating the interconnect as a fixed-function component.
- 200G/Lane and Beyond: Designed for 1.6T, 3.2T and future AI scale-up infrastructure.
What Is Intelligent Linear Connectivity?
Traditional linear connectivity eliminates power-hungry DSPs but historically provides limited visibility and adaptability. TeraSignal combines AWP wave-domain processing with TSLink diagnostics and adaptive link training to add intelligence and advanced signal processing while preserving the low-power, low-latency advantages of linear interconnects.