Los Angeles, Calif., March 16, 2026 – OFC 2026 – TeraSignal, a leader in intelligent interconnect technology, today announced that its TS9802 Intelligent TIA with TSLink™ Digital Eye Monitoring has been recognized with a 4.0 rating in the 2026 Lightwave + BTR Innovation Reviews in the Communications Semiconductors and Electrical ICs category. The prestigious program evaluates the most innovative technologies shaping the future of optical networking, data centers, and high-performance computing.
The TS9802 represents a major advancement in linear optical receiver technology, enabling hyperscale data center operators to deploy 200G per lane optical links with the power efficiency of DSP-free architectures while maintaining full link visibility and operational control.
As AI and machine learning infrastructure continues to scale rapidly, operators are transitioning from traditional DSP-based receivers to Linear Pluggable Optics (LPO), Near-Package Optics (NPO), and Co-Packaged Optics (CPO) in order to reduce power consumption and latency. However, these architectures historically lacked the diagnostics required to monitor signal integrity and maintain reliable operation.
The TS9802 solves this challenge by integrating TeraSignal’s proprietary TSLink™ Digital Eye Monitoring (DEM) directly into the TIA, restoring real-time visibility into link health without requiring a DSP or external microcontroller.
This intelligent architecture enables operators to monitor eye quality, extract bit-error-rate metrics, and dynamically optimize signal performance while maintaining the power efficiency required for large-scale AI clusters.
“The TS9802 demonstrates how intelligent analog design can transform the deployment of next-generation optical interconnects,” said Dr. Armond Hairapetian, Founder and CEO of TeraSignal. “By integrating TSLink digital eye monitoring directly into the receive path, we enable hyperscalers to deploy 1.6T linear optical links with the visibility, reliability, and operational confidence required for large-scale AI infrastructure.”
The TS9802 Intelligent TIA delivers a combination of high-performance analog amplification, linear equalization and embedded digital diagnostics, enabling reliable deployment of DSP-free optical architectures across hyperscale data centers and high-performance computing environments. Key capabilities include:
- TSLink™ Digital Eye Monitoring (DEM) for real-time eye diagram estimation and BER diagnostics
- Adaptive equalization that dynamically compensates for channel impairments such as PCB loss and optical dispersion
- 200G PAM4 per channel performance, supporting next-generation 1.6T optical interconnects
- Superior immunity to cross-talk due to fully differential architecture
- Linear phase response and stable input impedance over the entire bandwidth
- Integrated RSSI and automatic gain control, providing continuous monitoring of optical input power
- Compact bumped-die form factor optimized for high-density optical module integration
Availability
The TS9802 Intelligent TIA is available now to select partners and customers.
Live Demonstration at OFC 2025
Visit TeraSignal at OFC 2026 for a live demonstration of TSLink-enabled intelligent interconnect technologies in Booth 5436, March 17-19, at the LA Convention Center in Los Angeles, California.
About TeraSignal
TeraSignal is a leader in high-speed data transmission, specializing in intelligent interconnect solutions for AI Infrastructure, and next generation computing hardware, and Linear Optics. Our technologies and products focus on improving power efficiency, reducing latency, and lowering bit-error-rate, while providing advanced link diagnostics in optical interconnects. Through innovations in CMOS design and adaptive link training, TeraSignal is redefining intelligent optical connectivity across various components in AI infrastructure. Learn more at terasignal.com.
TeraSignal and TSLink are among the trademarks of TeraSignal. Other trademarks are the property of their respective owners.