See AWP + TSLink Live at ECOC 2026 | September 21–23 | Málaga, Spain | TeraSignal Booth 1336 | OIF Booth 2126
Industry First Analog Wave Processing for AI Interconnects
AWP brings wave-domain signal processing to 200G/lane linear connectivity for 1.6T and 3.2T AI infrastructure.
Lower Power
Lower Latency
Ultra-High Bandwidth
Intelligent Interconnects for AI Infrastructure
TeraSignal combines AWP wave processing with TSLink link intelligence to bring adaptive, lower-power, lower-latency connectivity to optical and copper AI interconnects.
From 200G/lane to 1.6T, 3.2T and beyond.
TeraSignal Introduces Industry-First Analog Wave Processor (AWP) for 200G/Lane AI Interconnects
AWP + TSLink: Intelligent Linear Connectivity
AWP performs high-speed wave processing directly in the analog domain, while TSLink measures, monitors and adapts the link. Together, they enable intelligent linear connectivity without the power and latency of a conventional DSP.
Wave-Domain Processing
Ultra-high-bandwidth signal processing with linear amplitude and phase response.
Link Intelligence
CMIS-based link training, monitoring and adaptive optimization.
Lower Power. Lower Latency.
Advanced linear connectivity without the power and latency of conventional DSP-based architectures.
200G/Lane Connectivity for 1.6T and 3.2T AI Infrastructure
TeraSignal’s intelligent connectivity architecture combines high-speed CMOS design, AWP wave processing and TSLink adaptive link intelligence to enable next-generation optical and copper interconnects.
TSLink™ Intelligent Link Training
TSLink™ provides CMIS-based link training, monitoring and adaptive optimization for high-speed linear interconnects. It identifies channel conditions in real time and works with AWP™ to optimize link performance.
DSP-Free Linear Connectivity
AWP™ brings advanced signal processing directly into the analog domain, helping preserve the low-power and low-latency advantages of linear interconnects while extending link margin and robustness.
Applications
TeraSignal’s intelligent connectivity technologies support next-generation AI scale-up infrastructure across optical and copper links, including LPO, NPO, CPO, ACC, Ethernet and PCIe applications.
AI and Accelerated Computing
TeraSignal enhances PCIe and CXL connectivity for GPUs (JBoG), accelerators, and FPGAs, maximizing link uptime. This ensures reliable, high-speed connections essential for advanced compute tasks in AI, providing the backbone for innovation.
Server Infrastructure
Our technology ensures high-bandwidth, low-latency PCIe connectivity for compute, storage, networking, and accelerator resources, crucial for server efficiency and data processing capabilities.
Expanding Memory Solutions
We deliver memory connectivity that not only expands bandwidth but also increases capacity, meeting the demands of modern data-driven applications and facilitating faster access to large datasets.
Next-Gen Networking
Active Ethernet (100/50/25G per Lane) along with PCIe/CXL offers both intra-rack and inter-rack connectivity, bridging the gap between devices with unprecedented speed and reliability.
Storage Connectivity
Our solutions support massive data storage demands, particularly in PCIe JBoF applications, ensuring data is stored and accessed efficiently to keep pace with growing digital storage needs.
AI and Accelerated Computing
Experience low latency and reliable PCIe and CXL connectivity for GPUs, accelerators, and FPGAs, ensuring maximum efficiency for AI and compute tasks.
Server Infrastructure
Achieve unmatched bandwidth and low-latency with PCIe for enhanced compute, storage, and network performance.
Memory Solutions
Expand bandwidth and capacity to meet the needs of data-intensive applications with advanced memory connectivity.
Networking
Leverage Active Ethernet and PCIe/CXL for superior intra-rack and inter-rack connectivity, supporting speeds up to 100G per lane.