TSLink Gains Momentum as the Industry’s Leading Low-Latency, Low-Power, Intelligent Interconnect Solution for AI and High-Performance Computing
IRVINE, Calif., February 27, 2025 – OFC 2025 – TeraSignal, a leader in intelligent interconnect technology, today announced that its TSLink solution has been recognized as a high-scoring honoree in the 2025 Lightwave + BTR Innovation Reviews in the Communications Semiconductors and Electrical ICs category. This prestigious industry award highlights TSLink’s role in redefining data transmission for AI-driven data centers and high-performance computing and has been distinguished among the best in the industry by the esteemed 2025 Lightwave + BTR Innovation Reviews.
TSLink is the industry’s first intelligent chip-to-module (C2M) interconnect, eliminating the need for DSPs and reducing power consumption by more than 50% while minimizing latency. By providing automatic link training, real-time diagnostics, and seamless integration into 800G LPO modules, TSLink ensures reliable, high-speed connectivity essential for next-generation AI and cloud infrastructure.
“This recognition reinforces the industry’s rapid adoption of TSLink as the go-to low-power, low-cost interconnect solution,” said Dr. Armond Hairapetian, Founder and CEO of TeraSignal. “With growing momentum leading into OFC 2025, TSLink is setting a new standard for AI and high-performance computing connectivity, delivering the scalability and efficiency customers demand.”
TSLink leverages TeraSignal’s TS8401/02 Intelligent Re-Drivers to deliver:
- 50% lower power consumption by eliminating DSPs and utilizing microcontroller resources.
- Ultra-low latency for real-time, high-speed data flow.
- Advanced digital eye monitoring and BER diagnostics for optimized signal integrity.
- Seamless deployment across 800G linear pluggable optics (LPO), near package optics (NPO), and co-packaged optics (CPO) to scale AI infrastructure efficiently.
“On behalf of the Lightwave + BTR Innovation Reviews, I would like to congratulate TeraSignal on achieving a well-deserved level honoree status,” said Sean Buckley, Editor in Chief of Lightwave + BTR. “This competitive program enables Lightwave+BTR to showcase and applaud the most innovative products, projects, technologies, and programs that significantly impact the industry.”
Availability
TSLink is now available to select partners and customers. For more information, visit www.terasignal.com.
Live Demonstration at OFC 2025
Visit TeraSignal at the upcoming OFC 2025 for live demo in booth #3327, from March 30 – April 3, 2025, at the Moscone Center in San Francisco, California.
About TeraSignal
TeraSignal is a leader in high-speed data transmission, specializing in intelligent interconnect solutions for AI-centric data centers, and next generation computing hardware, and Linear Optics. Our technologies and products focus on improving power efficiency, reducing latency, and lowering bit-error-rate, while providing advanced link diagnostics in optical interconnects. Through innovations in CMOS design and adaptive link training, TeraSignal is redefining intelligent optical connectivity across various components in AI infrastructure. Learn more at terasignal.com.
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TeraSignal and TSLink are among the trademarks of TeraSignal. Other trademarks are the property of their respective owners.