TeraSignal Demonstrates Interoperability with Synopsys 112G Ethernet PHY IP for High-Speed Linear Optics Connectivity
January 27, 2025
Enabling Plug-and-Play Solutions for High-Performance AI and Data Center Applications IRVINE, Calif., January 27, 2024 – DesignCon 2025 – TeraSignal, a leader in intelligent interconnect technology, announced the successful interoperability demonstration between its TSLink intelligent...
TeraSignal Showcases Intelligent Re-Drivers for AI Infrastructure at DesignCon 2025
January 27, 2025
Expanding the TSLink Portfolio with Low-Power, Low-Latency PCIe 6.0 Re-Drivers for Copper Interconnects in AI and Compute Infrastructure IRVINE, Calif., January 27, 2025 – DesignCon 2025 – TeraSignal, a leader in intelligent interconnect technology, will...
TeraSignal Honored with 2024 EDGE Award for Intelligent 400G PAM4 Modulator Driver
September 23, 2024
TS8401/02 and TSLink Architecture Drive Breakthroughs in 800G Linear Optics, Automatic Link Training, and Link Monitoring IRVINE, Calif., September 23, 2024 – TeraSignal, a leader in intelligent interconnect technology, today announced it has been named...
TeraSignal Introduces TSLink: Protocol-Agnostic Intelligent Interconnect for Plug-and-Play Linear Optics in AI Infrastructure
September 17, 2024
Innovative TSLink Architecture Based on TS8401/02 Enables Mass Adoption of Intelligent 800G LPO Modules with Automatic Link Training and Link Monitoring IRVINE, Calif., September 17, 2024 – ECOC 2024 – TeraSignal, a leader in intelligent...
TeraSignal Announces Industry’s First CMOS Intelligent Re-Drivers to Transform AI and Compute Interconnects
March 25, 2024
Innovative CMOS Re-Driver for 800G Linear Pluggable Optical (LPO) Modules Reduces Power By Up to 50% and Adds Link Training and Diagnostics to Enable Mass Adoption of LPO Modules IRVINE, Calif., March 25, 2024 –...