TeraSignal to Showcase Retimer-Less PCIe 6.0 over Optics Featuring Synopsys IP at OFC 2025
April 1, 2025
Expanding the TeraSignal TSLink TM Portfolio with Low-Power, Low-Latency PCIe 6.0 Re-Drivers for Optical Interconnects in AI and Compute Infrastructure SAN FRANCISCO, April 1, 2025 – OFC 2025 – TeraSignal, a leader in intelligent interconnect...
Published by: Lightwave
TeraSignal Unveils World’s First 4x200G Intelligent TIA with TSLink Digital Eye Monitor and Adaptive Equalizer for 1.6T Optical Interconnects
March 31, 2025
Superior Analog Performance Combined with Digital Diagnostics Enable Reliable Deployment of Energy Efficient Linear Optical Receivers IRVINE, Calif., March 31, 2025 – OFC 2025 – TeraSignal, a leader in intelligent interconnect technology, today announced the...
TeraSignal’s TSLink Recognized as a High-Scoring Honoree in the 2025 Lightwave + BTR Innovation Reviews
February 27, 2025
TSLink Gains Momentum as the Industry’s Leading Low-Latency, Low-Power, Intelligent Interconnect Solution for AI and High-Performance Computing IRVINE, Calif., February 27, 2025 – OFC 2025 – TeraSignal, a leader in intelligent interconnect technology, today announced...
Published by: Lightwave
TeraSignal: TSLink
February 26, 2025
TeraSignal's TSLink is optimized for AI infrastructure, data centers, high-performance computing, and other environments requiring high-speed, reliable interconnects.
TeraSignal Demonstrates Interoperability with Synopsys 112G Ethernet PHY IP for High-Speed Linear Optics Connectivity
January 27, 2025
Enabling Plug-and-Play Solutions for High-Performance AI and Data Center Applications IRVINE, Calif., January 27, 2024 – DesignCon 2025 – TeraSignal, a leader in intelligent interconnect technology, announced the successful interoperability demonstration between its TSLink intelligent...
TeraSignal Showcases Intelligent Re-Drivers for AI Infrastructure at DesignCon 2025
January 27, 2025
Expanding the TSLink Portfolio with Low-Power, Low-Latency PCIe 6.0 Re-Drivers for Copper Interconnects in AI and Compute Infrastructure IRVINE, Calif., January 27, 2025 – DesignCon 2025 – TeraSignal, a leader in intelligent interconnect technology, will...
Published by: Converge! Network Digest
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Published by: Parsers VC
Published by: NextGenInfra
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TeraSignal Honored with 2024 EDGE Award for Intelligent 400G PAM4 Modulator Driver
September 23, 2024
TS8401/02 and TSLink Architecture Drive Breakthroughs in 800G Linear Optics, Automatic Link Training, and Link Monitoring IRVINE, Calif., September 23, 2024 – TeraSignal, a leader in intelligent interconnect technology, today announced it has been named...
Published by: Converge!
Published by: Design News
TeraSignal Introduces TSLink: Protocol-Agnostic Intelligent Interconnect for Plug-and-Play Linear Optics in AI Infrastructure
September 17, 2024
Innovative TSLink Architecture Based on TS8401/02 Enables Mass Adoption of Intelligent 800G LPO Modules with Automatic Link Training and Link Monitoring IRVINE, Calif., September 17, 2024 – ECOC 2024 – TeraSignal, a leader in intelligent...
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Published by: Converge Digest
Published by: Converge Digest
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Published by: ElectronicsWeekly
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TeraSignal Announces Industry’s First CMOS Intelligent Re-Drivers to Transform AI and Compute Interconnects
March 25, 2024
Innovative CMOS Re-Driver for 800G Linear Pluggable Optical (LPO) Modules Reduces Power By Up to 50% and Adds Link Training and Diagnostics to Enable Mass Adoption of LPO Modules IRVINE, Calif., March 25, 2024 –...